Photonic chips face several significant disadvantages that can limit their widespread adoption and implementation. These challenges include technical limitations, higher manufacturing costs, complex production requirements, environmental sensitivities, and talent shortages. In this article, we're examining these obstacles and exploring various pathways around them. Experts at the Table: Semiconductor Engineering sat down to talk about where photonics is most useful — and most vulnerable — with James Pond, fellow at Ansys;. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. This enables high-speed, low-power, and low-cost optical modulators, which are essential for optical interconnects in data centers.
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